OM13497UL
NXP Semiconductors
- 生命週期狀態 Active
- RoHS RoHS Compliant
- 描述SURFACE MOUNT TO DIP EVALUATION
- 類別Prototyping Boards, Fabrication Kits
- 數據表 OM13497UL 數據表
- Share
有現貨: 0
引用它
技術細節
- Series:-
- Package:Bulk
- Part Status:Active
- Kit Type:Adapter, Breakout Boards
- Quantity:18 Pieces (3 Values - 6 Each)
- Package Accepted:HTSSOP, VFBGA, XFBGA
- Specifications:SMD to DIP
- Number of Positions:24