OM13497UL

NXP Semiconductors
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引用它

技術細節

  • Series:-
  • Package:Bulk
  • Part Status:Active
  • Kit Type:Adapter, Breakout Boards

 

  • Quantity:18 Pieces (3 Values - 6 Each)
  • Package Accepted:HTSSOP, VFBGA, XFBGA
  • Specifications:SMD to DIP
  • Number of Positions:24

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